Model No: MSP300 Microspectrophotometer and Film Thickness Measurement System
Introduction:
Microspectrophotometry (Micro-Photometry, Micro Spectrophotometry) is used to characterize optical properties of thin films, thick coatings over a micron region area. Microspectrophotometer is also called microreflectometer, micro-reflectometer, microspectrometer, microphotometer (Spectroscopic), microspectroscopic photometer etc. With unique design by Angstrom's professionals, user can enjoy digital imaging capability in Microspectrophotometers (MSP series) by live video, powerful digital editing, measurement tools for reflection, transmission, absorption spectra. Data acquisition only takes milliseconds. TFProbe software allows user to set up heating stage or cooling stage for kinetic study in real time for optical property changes such as reflectance, transmittance, coating thickness, refractive index (optical constants) etc. Automatic mapping function is also available in various Microspectrophotometer models with motorized X-Y stage or Rho-Theta Stage and also motorized focus function using Joystick. Wavelength range usually is an important factor for user to consider. Angstrom's microspectrophotometer covers from deep-ultraviolet (DUV) to near-infrared (NIR) ranges. Which range should be considered will depend on several factors such as what are thickness ranges for thin film or thick coating, what is typical wavelength range of interest for reflectance or transmittance and so on.
Features:
· Easy to operate with Window based software
· Advanced optics and rugged design for highest uptime and the best system performance
· Array based detector system to ensure fast measurement
· Affordable, portable and small footprint table top design
· Measure film thickness and Refractive Index up to 5 layers over micron size region
· Allow to acquire reflection, transmission and absorption spectra in milliseconds
· Capable to be used for real time spectra, thickness, refractive index monitoring
· System comes with comprehensive optical constants database and library
· Advanced Software allows user to use either NK table, dispersion or composite model (EMA) for each individual film
· Integrated Vision, spectrum, simulation, film thickness measurement system
· Apply to many different type of substrates with different thickness up to 200mm size
· 2D and 3D output graphics and user friendly data management interface
· Advanced Imaging software for dimension measurement such as angle, distance, area, particle counting and more
· Various options available to meet special applications
System Configuration:
· Model: AMSP300R
· Detector: CCD Array with 2048 pixels
· Light Source: DC regulated Halogen lamp
· Stage: Black Anodized Aluminum Alloy with manually adjustable travel distance 150mm by 150mm
· Long Working Distance Objectives: 4x, 10x, 50x
· Communication: USB
· Measurement Type: Reflection/Transmission spectra, Film thickness/refractive index and feature dimensions
· Computer: Intel Core 2 Duo Processor with 200GB Hard drive and DVD+RW Burner plus 19” LCD Monitor
· Power: 110– 240 VAC /50-60Hz, 3 A
· Dimension: 16’x16’x18’ (Table top setup)
· Weight: 120 lbs total
· Warranty: One year labor and parts
Specifications:
· Wavelength range: 400 to 1000 nm
· Wavelength Resolution: 1nm
· Spot Size: 100µm (4x), 40µm (10x),, 8µm (50x)
· Sample Size: 150x150mm standard
· Substrate Size: up to 20mm thick
· Measurable thickness range*: 10 nm to 25 µm
· Measurement Time: 2 ms minimum
· Accuracy*: better than 0.5% (comparing with ellipsometry results for Thermal Oxide sample by using the same optical constants)
· Repeatability*: < 2 ? (1 sigma from 50 thickness readings for 1500 ? Thermal SiO2 on Si Wafer)
Options:
· Wavelength extension to DUV (AMSP100) or NIR range (AMSP500)
· Higher power optics for smaller spot size
· Customized configuration for special applications
· Heating and Cooling Stage for dynamic study
· Optional stage size holding samples up to 300mm
· Higher wavelength range resolution down to 0.1nm
